Critical Material Contamination Control

The Semiconductor Industry is always challenged to produce high yielding products in the nanoscale regime. Yield limiters are a cumulative effect of critical material contamination that comes in contact with tool components. Clean room consumables, air, water, gases and cleaning chemicals can all be insidious sources of contamination. The only way to control for the sources of contamination is to evaluate, qualify and institute periodic monitoring. By not having qualified critical materials that meet today’s stringent requirements, parts cleanliness is jeopardized. Our recommended analysis and testing frequency portfolio below is a guide to achieving improved consistency in delivering clean parts.

Recommended Analysis and Testing Frequency for Critical Materials and Processes:

 

Critical Materials Full Qualification at Vendor/Brand/Material Change Quarterly Monitoring Monthly Monitoring System Change and PM
Packaging Material/Cleanroom consumables:CR Bags, Wipes, Gloves
Trace Metals x x    
Particles x x    
Anions and Cations x x    
Volatile Organics x x    
Environment: Cleanroom air and oven
Trace Metals x x   x
Anions x x   x
Volatile Organics x x   x
Compressed Inert Gas Line: CDA and Nitrogen
Trace Metals x x   x
Anions x x   x
Volatile Organics x x   x
Cleaning Chemicals
Trace Metals x   x x
Assay x   x x
Water Testing: UPW, Rinse Water, Bath Water
Trace Metals x   x x
Particle Counts x   x x
Bacteria x   x x
Dissolved Silica x   x x
Anions and Cations x   x x
TOC x   x x
Bead Blast Media
Trace Metals x   x x

 

 

 

 

 

 

 

 

 

 

 

 



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For more information, please contact us:

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